Advanced 3D Solder Paste Inspection and Measurement Systems

Booth C-1H10, NEPCON China 2014, Shanghai

Keep up with your line's beat rate - Fast 15 million height points per second

Inspect 01005 pads with confidence - Accurate and repeatable with 0.5 μm height resolution, 2 μm x-y resolution

From the lab to the line and back again - Portable and lightweight, rugged industrial design

Operator friendly - Easy-to-use software with intelligent solder paste and reference detection

Easy connectivity - Plug and play, fast Gigabit Ethernet connection to any PC

Quality - Premium components, backed by a two-year full warranty